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EPON Resin 834-X-90

For Ambient Cure Applications -Epoxy resin solution, 90% solids in xylene....

EPIKURE Curing Agent 3378

Fast set under low temperature and/or high humidity conditions. Useful for coatings and flooring applications....

DURITE D AL-132LF

Durite Resin D_AL-132LF is a liquid phenolic resole resin in furfuryl alcoholsuitable foruseas a wetting agent in the manufacture of grinding and cutting wheels....

Durite Resin SL-524B

Durite Resin SL-524B is a liquid phenolic resole resin suitable for foam applications....

EPON Resin 834

Unmodified Liquid Resin - Semi-solid. Used for prepregs and adhesives properties modifications....

EPON Resin 233

EPON Resin 233 is a low viscosity resin based on a mixture of Bisphenol-F and Bisphenol-A epoxy resin....

Astro Mel 400

Waterborne resin to crosslink hydroxy-functional polymers in coating and finishing formulations....

EPON Resin 1004F

Fusion Solids -Medium molecular weight usually reacted with vegetable oil acids to prepare epoxy ester resins....

Durite Resin PD-0744LB 01

Durite Resin PD-0744LB 01 is a fast-dissolving, high purity cresol formaldehyde novolac resin suitable for printing plate applications....

EPIKURE Curing Agent 3383

Superior film formation characteristics. Designed for chemically resistant flooring and glaze coats....

EPON Resin 1001-T-75

For Ambient Cure Applications -Resin solution, 75% solids in toluene....

EPON Resin CS-267

CS-267 is a 65%w solution of a modified fusion derived solid bisphenol A/epichlorohydrin epoxy resin thinned in a 1:1 blend of propylene glycol methyl ether acetate and toluene....

EPIKURE Curing Agent 3230

D230 polyoxypropylenediamine that has moderate reactivity, low viscosity, low color, low vapor pressure and high primary amine content. It resists blush, bloom and sweat-out in epoxy compositions....

Durite Resin SD-1817

Durite Resin SD-1817 is a high purity triazine novolac used in epoxy curing and PCB assembly applications....

Durite Resin RL-1244E

Durite Resin RL-1244E is a furfuryl alcohol based liquid phenolic resole resin used in refractory bricks....

EPIKURE Curing Agent 8545-W-52

EPIKURE Curing Agent 8545-W-52 is a non-ionic, water reducible, modified epoxy-amine adduct supplied at 52% solids in water. This product is a versatile, unique, new curing agent that can be combined with the whole range of standard or diluted liquid epoxy resins as well as with epoxy resin emulsions and/or dispersions....

EPIKURE Curing Agent 8535-W-50

Modified polyamidoamine adduct supplied at 50% solids in water designed for solvent-free, two-package epoxy coatings for light industrial masonry coatings....

EPI-REZ Resin WD-512

Water dispersible bisphenol A epoxy resin....

Durite Resin D_PD-126A

Durite Resin D_PD-126A is a low molecular weight, high purity cresol formaldehyde novolac resin used in semiconductor photoresist applications....

SiberProp™ Proppants (Canada)

Stress Bond Resin Coated Sand for Low Temperatures Applications:Up to 55 MPa (8,000 psi) closure stress Excellent conductivity at lower closure stresses....

EPI-REZ Resin 3546-WH-53

Waterborne dispersion of a solid Bisphenol A epoxy resin (EPON 1007-type) with a non HAPS co-solvent....

EPIKURE Curing Agent 3380

Moderate reactivity. Applications include industrial and chemically resistant flooring, glaze and sealer coatings, general purpose casting and encapsulating compounds....

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