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Asia Pacific

EPONOL™ Ultra High Molecular Weight Epoxy Resin for Enhanced Adhesion, Flexibility and Flow

EPONOL ultra high molecular weight epoxy resin is used to modify a variety of coatings, adhesives, electronics and plastics, generally to enhance flow, flexibility and adhesion.

In epoxy coatings, EPONOL resin reduces chipping and cracking and improves adhesion to polar substrates. It is recommended for one-package preconstruction shop primers and for higher performance phenolic and amino converted epoxy resin baking finishes.

When used to modify epoxy adhesives, electrical prepreg and laminate varnishes, EPONOL resins impart flexibility and improve flow, especially during thermal curing.

EPONOL resins can also be used as plastic additives that improve the blending of thermoplastic polymers.