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Epoxy Resin Molding Compounds

Hexion’s epoxy resin molding compounds give excellent electrical insulating and media resistance properties. They can be shaped to produce very dimensionally stable moldings. Typical applications include:

Electrical parts
Terminal boards
Bobbins
Car electronics
Spark plug connectors
Electromagnetic coils
Encapsulation of electronics
Lamp sockets for H4/H7

Large volume metal components with very thin wall sections (such as rotor jacketing for electric motors) can be produced without cracking because Hexion epoxy molding compounds cure without the use of liberating cleavage products.

Grades offering very low viscosities and good flow permit damage-free, all-around spraying of delicate electronic insertion elements.

Product	Description
Bakelite EP 8412	Epoxy moulding compound, inorganically filled, glass fibre reinforced, heat resistant, dimensionally stable, good electric and mechanical properties, very good chemical resistance, low viscosity, UL listed (RTI 155º C).
	Applications - Encapsulation of electric parts, e.g. electromagnetic coil
Bakelite EP 8413	Epoxy moulding compound, inorganically mica filled, good heat resistance, high viscosity flow characteristics.
	Applications - H4 and H7 lamp sockets
Bakelite EP 8414	Epoxy moulding compound, inorganically filled, glass fibre reinforced, highly heat resistant, good electrical properties, even at higher temperatures, very slight post shrinkage, increased media resistance, UL listed
	Applications – Electrical parts, thermally, chemically and mechanically stressed parts, e.g. terminal boards, bobbins, car electronics, reflectors, spark plug connectors