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Hexion’s epoxy resin molding compounds give excellent electrical insulating and media resistance properties. They can be shaped to produce very dimensionally stable moldings. Typical applications include:
Large volume metal components with very thin wall sections (such as rotor jacketing for electric motors) can be produced without cracking because Hexion epoxy molding compounds cure without the use of liberating cleavage products.
Grades offering very low viscosities and good flow permit damage-free, all-around spraying of delicate electronic insertion elements.
Product | Description | |
Epoxy moulding compound, inorganically mica filled, good heat resistance, high viscosity flow characteristics. | ||
Applications - H4 and H7 lamp sockets | ||
Epoxy moulding compound, inorganically filled, glass fibre reinforced, highly heat resistant, good electrical properties, even at higher temperatures, very slight post shrinkage, increased media resistance, UL listed | ||
Applications – Electrical parts, thermally, chemically and mechanically stressed parts, e.g. terminal boards, bobbins, car electronics, reflectors, spark plug connectors |