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Recipe

SF 1030 High White Enamel 828 3292

" High Gloss White Enamel for Low Temperature Applications EPON™ Resin 828 / EPIKURE™ Curing Agent 3292-FX-60 Formula Material Supplier Pounds Gallons Part A Ektasolve™ EP 2-Propoxyethanol Eastman Chemical Products, Inc. 50.0 6.59 EPON Resin 828 Hexion 180.0 18.56 Anti-Terra™...

Recipe

SF 1026 Zinc-Rich Primer 53-BH-35

" Zinc-Rich Primer EPONOL™ Resin 53-BH-35 Features One-package fast drying shop primer No hard settling on storage Excellent corrosion resistance Recommended as a primer in the maintenance, automotive and marine fields Formula Material Supplier Pounds Gallons Solvents & Additives Thixatrol...

Recipe

EPIKURE Curing Agent 3200, 3223, 3234 & 3245

Epoxy curing agents Polyamides for inks and adhesives Wet strength resins Corrosion inhibitors Oil and fuel additives Chelating agents As members of the ethylene amine family, they lend themselves to a wide variety of chemical reactions and enduse applications. For product prices, availability, or o...

Recipe

SF 6005 Chemical Resistant Topping 828 62 3370

" Chemical Resistant Floor Topping Epoxy EPON™ Resin 828 / HELOXY™ Modifier 62 / EPIKURE™ Curing Agent 3370 Introduction This floor topping formulation was designed for the majority of interior applications where resistance to a broad spectrum of chemicals is required. Typical of c...

Recipe

SF 7016 High Tg Compound 828 1001F

" High Tg Potting Compound EPON™ Resin 828 and 1001F Introduction This formulation illustrates the use of phthalic anhydride as a curing agent for epoxy resins when used in high service temperature encapsulations. Formula Material Supplier Pounds Gallons Resin Portion EPON Resin 828 Hexion 60....

Recipe

SF 1040 High Solids Primer 828 3164

" High Solids, Zinc-Rich Epoxy Primer EPON™ Resin 828 / EPIKURE™ Curing Agent 3164 Suggested Uses Recommended for shop- or field-applied steel primer Features Low toxicity maintenance primer Excellent corrosion resistance; affords galvanic protection to adjacent undercoated areas Low VOC...

Recipe

SF 8002 Flame Laminating Compound SU-8and1163

" Flame Retardant Prepreg Laminating Compound for High Temperature and Thin Laminating Applications EPON™ Resin SU-8 and 1163 Introduction A combination of EPON Resin SU-8 high functionality epoxy resin and EPON Resin 1163 brominated epoxy resin are used in this formuation for finished laminat...

Recipe

SF 6002 Industrial Floor Topping 828 and 813 3072 505

" Industrial Floor Topping and Patching System EPON™ Resin 828 and 813 / EPIKURE™ Curing Agent 3072 / HELOXY™ Modifiers 505 Introduction This general purpose floor topping and patching compound is designed for the majority of interior industrial applications. Resistance to a broad ...

Recipe

SF 1600 Block Fill Coating 828 8535

" Block Fill Coating EPON™ Resin 828 / EPIKURE™ Curing Agent 8535-W-50 Formula Material Supplier Pounds Gallons Part A EPON Resin 828 Hexion 113.0 11.70 HELOXY™ Modifier 8 Hexion 37.2 5.02 Pluronic F-98 Surfactant, 25% in water BASF Corp. 7.5 0.86 L-475 Defoamer Drew Chemical Corp....

Recipe

SF 5007 Flexible Caulking Compound 828 3055

" Flexible Caulking Compound EPON™ Resin 828 / EPIKURE™ Curing Agent 3055 Formula Material Supplier Pounds Gallons Part A EPON Resin 828 Hexion 66.70 6.89 Titanium Dioxide Du Pont Co. 33.30 0.95 Total Part A 100.00 7.84 Part B EPIKURE Curing Agent 3055 Hexion 109.22 13.83 Total Part B 10...

Recipe

SF 4002 High Cure Adhesive 8021 3271

" High Strength, Room Temperature Cure Adhesive Introduction This moderate reactivity, filled epoxy adhesive is a general purpose formulation characterized by development of high bond strength to a variety of substrates including metals, plastics, concrete, and glass. Suggested Uses General purpose ...

Recipe

SF 8038: FlameX™ Epoxy Resin System for Infusion and RTM of Aerospace Interior Parts

" Epoxy Resin System for Infusion and RTM of Aerospace Interior Parts EPON™ FlameX™ Resin 9600 / EPIKURE™ FlameX™ Curing Agent 9700 Introduction EPON FlameX Resin 9600 cured with EPIKURE FlameX Curing Agent 9700 is a non – halogenated, homogenous epoxy resin system desi...

Recipe

SF 4001 Rapid Cure Adhesive 8111 3270 and 3271

"Rapid Setting, Room Temperature Cure Adhesive EPON™ Resin 8111 / EPIKURE™ Curing Agent 3270 and 3271 Introduction This silica-filled epoxy adhesive system offers the convenience of an equal volume combining ratio of resin portion to converter portion, coupled with rapid bond strength de...

Recipe

SF 8014: Hand FRP Matrix 862 68 3234

" Hand Lay-up FRP Matrix EPON™ Resin 862 / HELOXY™ Modifier 68 / EPIKURE™ Curing Agent 3234 Introduction This hand lay-up system allows for high filler loading due to its low viscosity. This capability allows this system to be used both as a laminating resin and as an adhesive syst...

Recipe

SF 8017: Epoxy Resin System 826 862 LS-81K

" Epoxy Resin System for Pultrusion or Filament Winding EPON™ Resin 826 or EPON™ Resin 862 / LS-81K Anhydride Curing Agent (MTHPA) Introduction EPON Resin 826 or EPON Resin 862/LS-81K Curing Agent system is based on an epoxy resin cured with an anhydride. LS-81K Curing Agent is a formula...

Recipe

SF 8024: Resin System 828 9552

" Resin System for Closed Molding EPON™ Resin 828 / EPIKURE™ Curing Agent 9552 Introduction EPIKURE Curing Agent 9552 is a fast, room-temperature curing, low viscosity liquid, aliphatic amine. Resins cured with EPIKURE Curing Agent 9552 produce outstanding toughness characteristics. Sugg...

Recipe

SF 9000: Epoxy Dispersion Formulations Cured with Dicyandiamide

" Epoxy Dispersion Formulations Cured with Dicyandiamide EPI-REZ™ Resins 3522-W-60, 5520-W-60, 5003-W-53 and WD-510 Introduction EPI-REZ™ Resin 3522-W-60, EPI-REZ Resin 5520-W-60 and EPI-REZ Resin 5003-W-55 are nonionic, completely aqueous dispersions of epoxy resins. EPI-REZ Resin WD-51...

Recipe

SF 9002: Preparing Waterborne Dispersions of Elastomer Modified Epoxy Resins

" Preparing Waterborne Dispersions of Elastomer Modified Epoxy Resins EPI-REZ™ Resins WD-510 and WD-512 and EPON™ Resins 58005 and 58006 Introduction Elastomer modified epoxy resins are often used in epoxy resin formulations to increase flexibility, adhesion and fatigue resistance, parti...

Recipe

SF 8039: Toughened Epoxy Resin Systems for Filament Winding

" Toughened Epoxy Resin Systems for Filament Winding Epoxy Research Resin RSL-4515 / EPIKURE™ Curing Agent 3300 and Epoxy Research Curing Agent RSC-4577 Introduction Epoxy Research Resin RSL-4515/EPIKOTE Curing Agent 3300 or Epoxy Research Curing Agent RSC-4577 is based on a toughened epoxy cu...

Recipe

SF 1008 Gray Enamel

" Gray Enamel EPON™ Resin 1001-CX-75 / EPIKURE™ Curing Agent 3100-XY-60 Formula Material Supplier Pounds Gallons Part A Ti Pure R-960 Du Pont Company 100.0 2.86 Lampblack 3.0 0.20 Imperial Anti-Flooding (IAF) Compound X-2280 RLM Industries, Inc. 4.0 0.18 EPON Resin 1001-CX-75 Hexion 224....

Recipe

SF 1027 VOC Compliant Primer 828 3175

" VOC Compliant Lead and Chromate Free Primer EPON™ Resin 828 / EPIKURE™ Curing Agent 3175 Formula Material Supplier Pounds Gallons Part A EPON Resin 828 Hexion 238.1 24.68 CYMEL™ U-216-10LF Resin Cytec Industries 3.0 .59 Anti-Terra U Dispersant BYK-Chemie USA 5.0 .64 Toluene 75.0 ...

Recipe

SF 8013 Pre-Preg Matrix Solvent SU-8

" Prepreg Matrix Solvent MIL-R-9300, Type II EPON™ Resin SU-8 Introduction This compound is designed for the impregnation of bi-directional fiber cloth or uni-directional tape to form a tacky, drapable prepreg capable of low pressure molding into composites conforming with the requirements of ...

Recipe

SF 8012 Epoxy Body Solder 1001F

" Epoxy Body Solder EPON™ Resin 1001F Introduction This formulation is designed to meet handling properties characterized by conventional stick solder applications and to yield superior adhesion and durability. This compound will adhere to most metal surfaces. Formula Material Supplier Pounds ...

Recipe

SF 8009 Wet Laminating Binder 828 and 8132 3295

" EPON™ Resin 828 and 8132 / EPIKURE™ Curing Agent 3295 Introduction This formulation is for a room temperature curing, laminating binder designed for tooling and other structural applications. A reactive diluent with a low potential for skin irritation and a nonfuming aliphatic amine cu...

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