Please confirm your preference
Europe, Middle East, Africa
Asia Pacific

Durite™ Resin D_PD-427A


High purity cresol formaldehyde resin


D_PD-427A is used in semiconductor photoresist applications

Typical Properties

Target Value 


D_PD-427A Slow

D_PD-427A Fast


Crushed solid

Bulk dissolution rate, 2.38% TMAH developer, PAB 110°C/60 seconds

ca. 800 - 1700Å/sec

ca. 1700 - 2600Å/sec

Solution viscosity, 30% in PM acetate

32.0 – 44.0 cSt

25.0 – 37.0 cSt

Average molecular weight, GPC

ca. 4500 – 6000 g/mol

ca. 3500 – 5000 g/mol

Free cresol content, GC

max 1.0%

Individual trace metal content, GFAA

max 500 ppb

Tests are made in accordance with the current Hexion Standard Test Method and are available upon request. The typical properties provided are examples of product attributes and may not be tested.