Duration: 8 ms, Number of Results: 719

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Product

EPON Resin 828

" Unmodified Liquid Resin - General purpose epoxy resin. A base resin used for its balance of handling characteristics and performance properties." Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate a...

Product

EPIKURE Curing Agent 3140A

A low viscosity reactive polyamide, high imidazoline, moderate molecular weight epoxy curing agent based on dimerized fatty acid and polyamines Low viscosity for this class of curatives. Applications include adhesives and extending pot life of highly reactive amines. Disclaimer: ® and ™ Li...

Product

Epikote Resin MGS BPR20 and Epikure Curing Agent MGS BPH20

" Bonding Paste - is used in these applications: secondary bonding of FRP to FRP and various materials; production of rotor blades for wind energy plants and shipbilding; and sporting goods, moulds, tools and other devices."...

Product

EPIKOTE Resin 1001-X-75

EPIKOTE Resin 1001-X-75, a 75% solids solution in xylene of a solid epoxy resin produced from bisphenol A and epichlorohydrin. Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of prepara...

Product

EPIKOTE Resin 6520-WH-53

Waterborne dispersion of a solid Bisphenol A epoxy resin (EPON 1001-type) with a non HAPS co-solvent. Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of preparation or prepared from sou...

Product

EPIKOTE Resin 6006-W-68

Waterborne dispersion of an epoxidized o-cresylic novolac resin with an average functionality of 6. Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of preparation or prepared from sourc...

Product

EPONEX Resin 1510

Low viscosity cycloaliphatic glycidyl ether. Building block resin for higher molecular weight epoxies. Light fast. Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of preparation or prep...

Product

Bakelite Resin PF0262PS

" Bakelite Resin PF0262PS is a water based phenolic resole solution used in floral foam applications" Application: PF0262PS is used in floral foam applications Description: Water based phenolic resole solution Handling: This product has to be used and disposed of according to the indications given i...

Product

EPON Resin 862

" Unmodified Liquid Resin - Low viscosity, high performance alternative to blends of EPON Resin 828 and HELOXY Modifiers." Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of preparation...

Product

EPIKOTE Resin 7510-W-60

EPIKOTE Resin 7510-W-60 is a nonionic, waterborne emulsion of a liquid BPA epoxy resin. Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of preparation or prepared from sources believed ...

Product

EPON Resin 1031

" Functionality of 3.5. High temperature and chemical resistance." Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of preparation or prepared from sources believed to be reliable, but i...

Product

Durite Resin D_PD-1642

Durite Resin D_PD-1642 is a high purity cresol formaldehyde resin used in semiconductor photoresist applications. Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of preparation or prepa...

Product

EPIKOTE Resin 05335

Accelerated low viscosity epoxy resin blend based on a bisphenol A resin, containing an added proportion of a modification agent. Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of prep...

Product

EPI-REZ Resin 3515-W-60

" Waterborne dispersion of a semi-solid Bisphenol A epoxy resin."...

Product

EPI-REZ Resin 6520-WH-53

" Waterborne dispersion of a solid Bisphenol A epoxy resin (EPON 1001-type)with a non HAPS co-solvent." Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of preparation or prepared from s...

Product

EPIKURE Curing Agent 3388

Low viscosity for this class of curatives. Applications include adhesives and extending pot life of highly reactive amines. Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of preparatio...

Product

EPON Resin SU-8

" Polymeric solid epoxy novolac resin with a functionality of 8. Very high temperature stability. Used in electronics, FRP and adhesives." Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the tim...

Product

EPIKOTE Resin 3520-WY-55

Waterborne dispersion of a solid Bisphenol A epoxy resin (EPON 1001-type) with an organic co-solvent. Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of preparation or prepared from sou...

Product

EPIKOTE Resin 5522-WY-55

Waterborne dispersion of a modified Bisphenol A epoxy resin (EPON 1002-type)with an organic co-solvent. Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of preparation or prepared from s...

Product

EPON Resin 863

" Unmodified Liquid Resin - Low viscosity, crystallization resistant, high performance alternative to blends of EPON Resin 828 and HELOXY Modifiers." Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate...

Product

EPIKOTE™ Resin 828LVEL

" Viscosity range intermediate between EPIKOTE 827 and EPIKOTE 828EL. Performance similar to EPIKOTE 828EL. Low hydrolysable chlorine content, designed for applications in the electrical and electonics industries. Also suitable for advancement to solid resins."...

Product

EPIKURE Curing Agent 541

Light color and low viscosity modified cycloaliphatic amine curing agent. This curing agent contains no Nonylphenol. Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of preparation or pr...

Product

EPIKOTE Resin 828

General purpose bisphenol A resin. A base resin used for its balance of handling characteristics and performance properties. Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of preparati...

Product

Bakelite PF 1110

Phenolic moulding compound, inorganically filled, glass fibre reinforced, high heat resistance, very low coefficient of thermal expansion, highest resistance to pressure, high dimensional stability.Motor vehicle engine attachments, insulating flanges, brake pistons, sensors, grinding disc centers, b...

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