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EPON™ Resin 1031

Description

EPON™ Resin 1031 is a solid, novolac-free multifunctional epoxy resin. It is most frequently used to improve the properties of cured epoxy resin systems particularly at elevated temperatures. It finds applications in electrical laminates, high performance aerospace composites and adhesives, powder coatings, and molding compounds. The use of EPON Resin 1031 in epoxy formulations increases the crosslink density of cured systems and, subsequently, raises the glass transition temperature. At elevated temperatures, such systems have greater strength and rigidity and show improved moisture resistance and retention of electrical properties. EPON Resin 1031 also provides the fluorescence and UV blocking properties often required for printed wiring board applications.

Application

In part due to its excellent thermal performance and optical properties, EPON Resin 1031 is commonly included in formulations to make laminates for the supportof low and high density electrical circuits. Properly formulated systems using this resin are capable of meeting the demanding dimensional stability and automated optical inspection requirements of multilayer printed circuit boards. Furthermore, the addition of EPON Resin 1031 helps prevent solder mask “print through” for all circuit boards. The low level of ionic impurities in this resin contributes to high electrical resistance. The low saponifiable chloride content helps to improve varnish reactivity consistency and shorten cure time with selected curing agents, the latter of which can lead to improved laminate production speeds.

For rigid and multilayer laminate applications, EPON Resin 1031 is often used at a level of 5 to 30% by weight with a brominated epoxy resin. Laminates prepared from prepregs with this level of EPON Resin 1031 modification possess many of the same properties as conventional FR-4 boards, but with a substantial increase in thermal resistance. Glass transition temperatures up to 160 °C (by DSC) can be achieved at the 30 weight percent solids level. No special handling of prepreg by fabricators is typically necessary as pre-preg press conditions are similar to those for conventional FR-4 systems.

EPON Resin 1031 is also used in structural composites and adhesives. High performance products are made for aircraft and aerospace applications where cured resin systems are used for metal-to-metal bonding and structural components. The strong adhesive properties of epoxy resins as well as the retention of other physical properties at higher temperatures are particularly important in these end uses.

The ease of grinding EPON Resin 1031 into uniform particle sizes combined with its low melt viscosity also make it an excellent candidate for use in epoxy resin powder coatings and molding compounds.

Benefits

  • An average of greater than three reactive groups per molecule
  • Low saponifiable chloride content
  • Low ionic contaminants
  • Low melt viscosity
  • Optical fluorescence
  • Strong absorbance of UV light
  • Easily ground into uniform particle size
  • Good storage stability

Sales Specification

Property Standard Value Unit Test Method
Epoxide Equivalent Weight 195 - 230 g/eq ASTM D1652
Viscosity at 25°C Z – Z5 Gardner ASTM D1545

Typical Properties

Property Standard Value Unit Test Method
Color 1 18 - 0 Gardner ASTM D1544
Melt Viscosity at 150°C 15 P
Saponifiable Chloride 0.08 % wt.

1 80%wt solution in Methyl Ethyl Ketone (MEK)