EPON™ Resin CS-373

Description

EPON™ Resin CS-373 is a one-pack, dicy-free, brominated epoxy resin and curing agent solution supplied as 70% by weight solids in a blend of methyl ethyl ketone (MEK) and propylene glycol monomethyl ether (PGME). This resin system meets the increasing demands of FR-4 printed circuit board applications and provides laminates with a nominal glass transition temperature (Tg) of 180°C and excellent thermal stability.

Benefits

• High glass transition temperature
• Excellent thermal stability
• Flame retardance
• Good solder resistance
• Good moisture and CAF resistance
• Increased optical density for UV blocking
• Fluorescence for automated optical inspection (AOI)
• Potential for fast treater speeds and reduced laminate cure times

Sales Specification

Typical Properties