


EPON™ Resin CS-373 is a one-pack, dicy-free, brominated epoxy resin and curing agent solution supplied as 70% by weight solids in a blend of methyl ethyl ketone (MEK) and propylene glycol monomethyl ether (PGME). This resin system meets the increasing demands of FR-4 printed circuit board applications and provides laminates with a nominal glass transition temperature (Tg) of 180°C and excellent thermal stability.
Property | Standard | Value | Unit | Test Method |
---|---|---|---|---|
Bromine Content | 12.5 - 14.5 | % wt. | ||
Chlorine, Hydrolysable | 0.035 max. | % wt. | ASTM D1726 | |
Color | 3 max. | Gardner | ASTM D1544 | |
Solids | 69 - 71 | % wt. | ASTM D1259 | |
Viscosity at 25°C | 100 - 600 | cP | ASTM D1545 | |
Weight per Epoxide | 350 - 400 | g/eq | ASTM D1652 |
Property | Standard | Value | Unit | Test Method |
---|---|---|---|---|
Density | 9.4 | lb/gal | ASTM D1475 |
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