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On February 1, 2022, Hexion Holdings Corporation announced that it has completed the sale of its Coatings and Composite businesses, which includes the epoxy specialty resins and base epoxy resins and intermediates product lines, to Westlake Chemical Corporation. For epoxy coatings and composite product inquiries, please contact customer service at or

EPON™ Resin CS-373


EPON™ Resin CS-373 is a one-pack, dicy-free, brominated epoxy resin and curing agent solution supplied as 70% by weight solids in a blend of methyl ethyl ketone (MEK) and propylene glycol monomethyl ether (PGME). This resin system meets the increasing demands of FR-4 printed circuit board applications and provides laminates with a nominal glass transition temperature (Tg) of 180°C and excellent thermal stability.


  • High glass transition temperature
  • Excellent thermal stability
  • Flame retardance
  • Good solder resistance
  • Good moisture and CAF resistance
  • Increased optical density for UV blocking
  • Fluorescence for automated optical inspection (AOI)
  • Potential for fast treater speeds and reduced laminate cure times

Sales Specification

Property Standard Value Unit Test Method
Bromine Content 12.5 - 14.5 % wt.
Chlorine, Hydrolysable 0.035 max. % wt. ASTM D1726
Color 3 max. Gardner ASTM D1544
Solids 69 - 71 % wt. ASTM D1259
Viscosity at 25°C 100 - 600 cP ASTM D1545
Weight per Epoxide 350 - 400 g/eq ASTM D1652

Typical Properties

Property Standard Value Unit Test Method
Density 9.4 lb/gal ASTM D1475

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