Please confirm your preference
Europe, Middle East, Africa
Asia Pacific

EPON™ Resin CS-373


EPON™ Resin CS-373 is a one-pack, dicy-free, brominated epoxy resin and curing agent solution supplied as 70% by weight solids in a blend of methyl ethyl ketone (MEK) and propylene glycol monomethyl ether (PGME). This resin system meets the increasing demands of FR-4 printed circuit board applications and provides laminates with a nominal glass transition temperature (Tg) of 180°C and excellent thermal stability.


  • High glass transition temperature
  • Excellent thermal stability
  • Flame retardance
  • Good solder resistance
  • Good moisture and CAF resistance
  • Increased optical density for UV blocking
  • Fluorescence for automated optical inspection (AOI)
  • Potential for fast treater speeds and reduced laminate cure times

Sales Specification

Property Standard Value Unit Test Method
Bromine Content 12.5 - 14.5 % wt.
Chlorine, Hydrolysable 0.035 max. % wt. ASTM D1726
Color 3 max. Gardner ASTM D1544
Solids 69 - 71 % wt. ASTM D1259
Viscosity at 25°C 100 - 600 cP ASTM D1545
Weight per Epoxide 350 - 400 g/eq ASTM D1652

Typical Properties

Property Standard Value Unit Test Method
Density 9.4 lb/gal ASTM D1475

Welcome to Hexion eSecurity
Your platform for receiving secure content.
If you've received a notification, you can validate its authenticity by going to our validation page.