Previous 3 4 5 6 7 Next Page 5 of 22

EPIKURE Curing Agent 3253

Tertiary amine accelerator. Co-activating accelerator for epoxy resin curing agents including polyamides, fatty amidoamines, polysulfides and acid anhydrides....

EPON Resin 162

Multifunctional epoxidized phenolic novolac resin with a functionality of 2.2. Low viscosity, good thermal stability and chemical resistance....

EPON Resin 830

Unmodified Liquid Resin -Minimal crystallization tendency; higher viscosity then EPON Resin 828....

EPON Resin 8131

Modified Liquid Resins and Blends -Flexibilizing resin for flooring and adhesives applications. Low viscosity....

EPIKURE Curing Agent 8540-MU-60

Low aromatic solvent version of EPI-CURE Curing Agent 8536....

EPI-REZ Resin 5003-W-55

Waterborne dispersion of an epoxidized Bisphenol A novolac resin with an average functionality of 3 (EPON SU-3 type)....

EPIKURE Curing Agent 8536-MY-60

Modified polyamidoamine adduct supplied at 60% solids in a blend of solvents for low VOC, two-package, water-reducible epoxy coatings exhibiting good corrosion and chemical resistance for applications in industrial maintenance, industrial finishes, and masonry coatings....

Aricel PC-6A

Waterborne resin to crosslink hydroxy-functional polymers without a strong acid catalyst....

EPON Resin 2005

Powder Coating / Molding Powder Solids -Standard BPA based resin, melt point 110-120C. Provides thicker films....

Durite Resin PD-1672

Durite Resin PD-1672 is a high purity cresol formaldehyde resin used in semiconductor photoresist applications....

EPON Resin 1031-A-70

Resin solution, 70% solids in acetone. Functionality of 3.5. High temperature and chemical resistance....

EPIKOTE Resin 5392-XI-80

EPIKOTE Resin 5392-XI-80 is a fast curable, multifunctional epoxy resin based on bisphenol-A, 80wt% solid solution in xylene and isobutanol(70/30)....

Urea Formaldehyde Concentrate

UFC, or urea-formaldehyde-concentrate, is a unique formaldehyde - urea solution containing a high concentration of formaldehyde and urea. UFC requires storage at temperatures between 10 C (50 F) and 40C (104 F) to prevent precipitation of formaldehyde polymers at temperatures below 10C, or the increase in viscosity and lower available formaldehyde content that occurs at storage temperatures 40 C....

EPON Resin 1001-H-75

For Ambient Cure Applications -Resin solution, 75% solids in PGME...

EPON Resin 872

Modified Liquid Resins and Blends -Flexibilizing resin adduct....

EPON Resin 874-CX-90

For Ambient Cure Applications -Epoxy resin solution, 90% solids in MIBK/xylene....

EPON Resin 8281

Modified Liquid Resins and Blends -Anti-settling and anti-foaming resin for high levels of silica fillers....

Durite Resin RL-964B

DuriteResin RL-964B is a liquid phenolic resole resin suitable for use as a binder for refractory applications....

EPI-REZ Resin 3540-WY-55

Waterborne dispersion of a solid Bisphenol A epoxy resin (EPON 1007-type) with an organic co-solvent....

EPON Resin RSW-2801

EPON Resin RSW-2801 is a nonionic, waterborne dispersion of a multifunctional epoxy resin....

Durite Resin AL-3029C

Durite Resin AL-3029C is a water-soluble, urea-formaldehyde resin suitable for use in coated abrasives andas a temporary binder in the manufacture of ceramic grinding wheels....

Previous 3 4 5 6 7 Next Page 5 of 22