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EPIKURE Curing Agent 3273

High reactivity curing agent designed for adhesives applications....

EPIKURE Curing Agent 3030

Longer pot life version ofEPIKURE Curing Agent 3015...

EPIKURE Curing Agent 3274

Low color. Provides blush and sweat-out free films. Applications include glaze and high build coatings, FRP, decoupage, encapsulation and casting compounds....

Cellobond Resin J6070L

Cellobond Resin J6070L is a liquid phenolic resole resin suitable for the production of foam for mining applications....

EPON Resin 1001-B-80

EPON Resin 1001-B-80 is a 80 percent solids solution of an EPON 1001F type epoxy resin in methyl ethyl ketone....

EPIKURE Curing Agent 3125

Medium viscosity curative providing non-critical combining ratios, toughness, flexibility and water resistance for applications such as adhesives....

Durite Resin D_PD-1630

Durite Resin D_PD-1630 is a medium molecular weight, high purity cresol formaldehyde novolac resin used in semiconductor applications....

Durite Resin SD-241A

Durite Resin SD-241A is a high purity ortho-cresol formaldehyde novolac resin is used in epoxy intermediates and PCB assembly applications....

EPIKURE Curing Agent 3295

Uses include electrical, tooling and laminating....

EPIKURE Curing Agent 3393

EPIKURE Curing Agent 3393 is a low viscosity, solvent-free curing agent. It is recommended for use in low viscosity civil engineering formulas...

Durite Resin AL-382B

Durite Resin AL-382B is a liquid, heat-reactive, one-step phenolic resin suitable for use as a wetting ("pick-up") agent for abrasive bonds....

EPIKURE Curing Agent 8537-WY-60

A water reducible amine adduct supplied at 60% solids in water, 2-propoxyethanol and glacial acid for low VOC, two-package, waterborne coatings systems exhibiting excellent chemical resistance for applications in trade sale coatings, industrial maintenance, and industrial finishes....

EPIKURE Curing Agent 3388

Low viscosity for this class of curatives. Applications include adhesives and extending pot life of highly reactive amines....

EPON Resin 8161

Modified Liquid Resins and Blends -Anti-settling and anti-foaming resin for highly filled systems....

EPON Resin 2024

Powder Coating / Molding Powder Solids - Standard BPA based resin formulated with a flow control agent, melt point 95-105C....

EPIKURE Curing Agent 3251

Curing agent designed for low temperature, high humidity applications....

Durite™ Resin FD-2170

Durite Resin FD-2170 is a powdered, heat resistant, phenolic resin of the novolac type....

EPIKURE Curing Agent 3300

A very low viscosity, light colored cycloaliphatic amine curing agent for use in formulating heat cured epoxies, with relatively high heat distortion properties when properly cured....

AcTivator™ Consolidation Aid

Low temperature consolidation aid for curable resin coatedproppants....

Fines-Sta™ 100

Fines Control Agent...

EPIKURE Curing Agent 3055

Long pot life, general purpose epoxy curing agent. Applications include adhesives, FRP, electrical encapsulants, grouts, floor topping and repair compositions...

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