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Product
EPON Resin 828
Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of preparation or prepared from sources believed to be reliable, but it is the responsibility of the user to investigate and understand o...
Product
EPIKURE Curing Agent 3370
Applications include industrial and chemically resistant floor toppings, light colored casting and tank lining applications. Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of preparati...
Product
EPIKOTE Resin 827
" Lower viscosity than EPIKOTE 828 and EPIKOTE 828LV. Performance similar to EPIKOTE 828. Subject to crystallisation when cold." Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of prepa...
Product
Astro Mel 601
Hexamethoxymethyl-type resin to crosslink solvent-based and waterborne polymers. Application: Astro Mel 601 can be used to crosslink a variety of solvent-based and waterborne polymers that contain hydroxyl, amino, amido, and carboxyl functional groups. Acid catalysts, such as toluenesulfonic acid, a...
Product
EPIKOTE Resin 6520-WH-53A
Waterborne dispersion of a solid Bisphenol A epoxy resin (EPON 1001-type) with a non HAPS co-solvent. Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of preparation or prepared from sou...
Product
EPIKURE Curing Agent 3055
Long pot life, general purpose epoxy curing agent. Applications include adhesives, FRP, electrical encapsulants, grouts, floor topping and repair compositions Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be...
Product
EPIKURE Curing Agent 3253
" Tertiary amine accelerator. Co-activating accelerator for epoxy resin curing agents including polyamides, fatty amidoamines, polysulfides and acid anhydrides." Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to...
Product
Astro Mel NW-3A
Waterborne self-condensing resin to provide film hardness and crosslink hydroxy-functional polymers. Application: Astro Mel NW-3A is a waterborne resin that can be used to crosslink hydroxy-functional polymers in formulations used for wood coatings, nonwoven binders, and textile finishing. This resi...
Product
Bakelite PF 6507
Phenolic moulding compound, inorganically filled, glass fibre reinforced, elastomer modified, galvanizable, heat resistant, good media resistance, high dimensional stability at raised temperature, high mechanical strength.Cooling pumps, solenoid switch covers magnetic switches, mechanically and ther...
Product
Astro Mel CR-1
Waterborne self-condensing resin to provide film hardness and crosslink hydroxy-functional polymers. Application: Astro Mel CR-1 is a waterborne resin that can be used to crosslink hydroxy-functional polymers in formulations used for wood coatings, nonwoven binders, and textile finishing. This resin...
Product
HELOXY Modifier 71
" Flexibilizer - Improves impact resistance as well as toughness." Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of preparation or prepared from sources believed to be reliable, but i...
Product
VeoVa™ 10 Monomer
" VeoVa 10 Monomer is the vinyl ester of Versatic Acid 10. VeoVa 10 Monomer is widely used as a modifying co-monomer in the manufacture of vinyl acetate based polymer latices. VeoVa 10 is also used for the production of VeoVa 10/(meth)acrylic latices and solution polymers." Disclaimer: ® and &tr...
Product
EPIKOTE™ Resin 869
EPIKOTE™ Resin 869 is a low viscosity epoxy resin produced from the reaction of bisphenol F and epichlorohydrin, containing no diluent. Like other bisphenol F epoxy resins, it has improved chemical resistance and lower viscosity than bisphenol A epoxy resins. The higher molecular weight of EPI...
Product
EPON Resin 826
" Unmodified Liquid Resin - A low viscosity resin. Possesses performance properties similar to EPON Resin 828. Capable of accepting higher filler levels. Subject to crystallization when cold." Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believ...
Product
EPON Resin 1001F
" Fusion Solids - Basic coating and prepreg resin; sinters upont storage." Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of preparation or prepared from sources believed to be reliabl...
Product
EPIKURE Curing Agent 6870-W-53
Aqueous dispersion of an amine adduct curing agent. Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of preparation or prepared from sources believed to be reliable, but it is the respon...
Product
EPI-REZ Resin 3540-WY-55
Waterborne dispersion of a solid Bisphenol A epoxy resin (EPON 1007-type) with an organic co-solvent. Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of preparation or prepared from sou...
Product
Cellobond Resin J2027L
" Cellobond Resin J2027L is a liquid phenolic resole resin suitable for the manufacture of heat resistant composites and laminates." Typical Properties: [TableHere] Tests are made in accordance with the current Hexion Standard Test Method and are available upon request Application: J2027L is used to...
Product
EPIKURE Curing Agent 3015
Applications include adhesives, electrical encapsulants and grouts. Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of preparation or prepared from sources believed to be reliable, but ...
Product
EPON Resin 1007F
" Fusion Solids - Moderately high molecular weight resin used for baked industrial coatings cured with urea- formaldehyde and phenol-formaldehyde resins." Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be acc...
Product
EPIKURE Curing Agent 3271
" Uses include rapid setting adhesives, cable splicing compounds, tooling, gel coats and low temperature applications." Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of preparation or...
Product
EPIKOTE Resin 828
" General purpose bisphenol A resin. A base resin used for its balance of handling characteristics and performance properties." Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of prepar...
Product
Bakelite PF 31
Phenolic moulding compound, mainly organically filled, standard moulding compound for normal stress, UL listed moulding compound 1.5 mm / V-1 (ALL), 3.0 mm / V-0 (ALL).Mouldings of all kinds from screw caps to large casings, electrical installation material, handle casings (bars), pan handles, opera...
Product
EPIKOTE Resin 3540-WY-55A
EPIKOTE Resin 3540 WY 55 is a 55 percent solids dispersion of EPIKOTE Resin 1007 in water and 2-propoxyethanol. Disclaimer: ® and ™ Licensed trademarks of Hexion Inc. The information provided herein was believed by Hexion Inc. ( Hexion ) to be accurate at the time of preparation or prepare...